In-situ deposition of diamond on functionally graded copper scaffold for improved thermal conductivity and mechanical properties

• A functionally graded diamond network with high quality was fabricated. 3D printed Cu coarse surface utilized for in-situ growth of diamond. Thermal conductivity and compressive strength were improved significantly. novel structure developed significantly enhanced thermal strength, based on synergistic effects combining chemical vapor deposition (CVD) selective laser melting (SLM). In-situ achieved without conventionally complex pretreatment steps thanks to the roughness as-printed copper scaffold. The continuous film coated scaffold forms a monolith interconnected network, acting as an effective layer heat conduction exceptional increase (459%) in compared counterpart. also demonstrates progressive mechanical response loading uniform structure. This work opens new avenue realizing three-dimensional proves its multifunctionalities, especially high-power electronics applications.